发明名称 Thermal device with electrokinetic air flow
摘要 In some embodiments a thermal device such as a heat sink cools an electronic device. An electrokinetic airflow generating device uses a positively charged source and also uses at least a portion of the thermal device as a negatively charged or grounded probe to provide electrokinetically driven airflow. Other embodiments are described and claimed.
申请公布号 GB2468456(B) 申请公布日期 2012.09.19
申请号 GB20100010830 申请日期 2008.11.26
申请人 INTEL CORPORATION 发明人 JOHAN F PLOEG;SERI LEE
分类号 H05K7/20;F28F13/16;H01L23/467 主分类号 H05K7/20
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