发明名称 Efficient Substrate Dicing by Optimized Temporal Intensity Distribution of Ultrafast Femtosecond Pulses
摘要 PURPOSE: A cutting method through control of light intensity depending on the time of femtosecond pulse laser is provided to maximize the effect of a processing mechanism, which bases on multi photon ionization and avalanche ionization. CONSTITUTION: A cutting method through control of light intensity depending on the time of femtosecond pulse laser comprises next steps. At least two femtosecond laser pulses are generated separately to have a time interval using pulse delay(120). Each pulse excites electrons on a target(200) based on multi photon Ionization. The electrons excited from the multi photon ionization through avalanche ionization are used as seeds to increase the ionization of a material. Each of at least two femtosecond laser pulses is output, wherein one or more of their pulse width, pulse energy threshold, and inter-pulse interval are different.
申请公布号 KR101181718(B1) 申请公布日期 2012.09.19
申请号 KR20100057008 申请日期 2010.06.16
申请人 发明人
分类号 B23K26/382;H01S3/10 主分类号 B23K26/382
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