| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which exhibits good fluidity, curability, mold release and continuous moldability and has an excellent soldering resistance, not causing peeling nor cracking during a high temperature soldering process using leadless solder. <P>SOLUTION: The epoxy resin composition includes (A) an epoxy resin, (B) a phenolic resin-based hardener, (C) an inorganic filler, (D) a hardening promotor, and (E) a mold release agent. The hardening promotor (D) contains (d1) a hardening promotor having a cationic portion and silicate anion portion. The mold release agent (E) contains a glycerol tri-fatty acid ester (e1). The semiconductor device uses the epoxy resin composition for sealing a semiconductor device. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
