| 摘要 |
Provided is a light emitting device (100). The light emitting device includes a plurality of metal layers (11,13) spaced from each other, a first insulation film (21) having an opened area (A1) in which a portion of the plurality of metal layers is opened, the first insulation film being disposed on a periphery portion of top surfaces of the plurality of metal layers, a light emitting chip (41) disposed on at least one of the plurality of metal layers, the light emitting chip being electrically connected to the other metal layer, a resin layer (61) disposed on the plurality of metal layers and the light emitting chip, and a first guide member (31) disposed on the first insulation film. |
