发明名称 |
Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation |
摘要 |
A method of forming an organic silica film includes forming a coating including a silicon compound having an —Si—O—Si— structure and an —Si—CH2—Si— structure on a substrate, heating the coating, and curing the coating by applying ultraviolet radiation. |
申请公布号 |
US8268403(B2) |
申请公布日期 |
2012.09.18 |
申请号 |
US20050596295 |
申请日期 |
2005.04.28 |
申请人 |
AKIYAMA MASAHIRO;NAKAGAWA HISASHI;YAMANAKA TATSUYA;SHIOTA ATSUSHI;KUROSAWA TAKAHIKO;JSR CORPORATION |
发明人 |
AKIYAMA MASAHIRO;NAKAGAWA HISASHI;YAMANAKA TATSUYA;SHIOTA ATSUSHI;KUROSAWA TAKAHIKO |
分类号 |
B05D3/02;C09D183/04;C08G77/42;C08G77/50;C08L83/14;C09D5/25;C09D183/14;H01B3/46;H01L21/3105;H01L21/312;H01L21/316;H01L21/768;H01L23/522 |
主分类号 |
B05D3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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