发明名称 Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formation
摘要 A method of forming an organic silica film includes forming a coating including a silicon compound having an —Si—O—Si— structure and an —Si—CH2—Si— structure on a substrate, heating the coating, and curing the coating by applying ultraviolet radiation.
申请公布号 US8268403(B2) 申请公布日期 2012.09.18
申请号 US20050596295 申请日期 2005.04.28
申请人 AKIYAMA MASAHIRO;NAKAGAWA HISASHI;YAMANAKA TATSUYA;SHIOTA ATSUSHI;KUROSAWA TAKAHIKO;JSR CORPORATION 发明人 AKIYAMA MASAHIRO;NAKAGAWA HISASHI;YAMANAKA TATSUYA;SHIOTA ATSUSHI;KUROSAWA TAKAHIKO
分类号 B05D3/02;C09D183/04;C08G77/42;C08G77/50;C08L83/14;C09D5/25;C09D183/14;H01B3/46;H01L21/3105;H01L21/312;H01L21/316;H01L21/768;H01L23/522 主分类号 B05D3/02
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