发明名称 CMP PAD CONDITIONER DISC
摘要 PURPOSE: A CMP(Chemical Mechanical Polishing) pad conditioner is provided to enable to reduce an economic loss caused by discarding a polishing plate if the polishing plated is made of materials relatively cheap such as engineering plastics. CONSTITUTION: A CMP pad(1) conditioner comprises a conditioner shank(2) and a polishing plate(4). The conditioner shank is formed into a plate shape. The polishing plate is attached on a front surface of the conditioner shank by an adhesive. The polishing plate comprises a fastener being coupled by passing through the conditioner disc. The polishing plate comprises a plate shaped plastic substrate.
申请公布号 KR20120102232(A) 申请公布日期 2012.09.18
申请号 KR20110020236 申请日期 2011.03.08
申请人 SHINHANDIAMONDINDUSTRIAL CO., LTD. 发明人 KIM, SHIN KYUNG;SONG, BRIAN;PARK, MUN SEAK;YU, BYOUNG RYOUN;KIM, KANG JUN;PARK, SUN WOO;KIM, JEONG;BYUN, SUNG KEUN;KIM, KYOUNG JIN;JUNG, HYUNG NOH
分类号 B24D7/06;B24B53/12;B24D3/10;H01L21/304 主分类号 B24D7/06
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