PURPOSE: A CMP(Chemical Mechanical Polishing) pad conditioner is provided to enable to reduce an economic loss caused by discarding a polishing plate if the polishing plated is made of materials relatively cheap such as engineering plastics. CONSTITUTION: A CMP pad(1) conditioner comprises a conditioner shank(2) and a polishing plate(4). The conditioner shank is formed into a plate shape. The polishing plate is attached on a front surface of the conditioner shank by an adhesive. The polishing plate comprises a fastener being coupled by passing through the conditioner disc. The polishing plate comprises a plate shaped plastic substrate.
申请公布号
KR20120102232(A)
申请公布日期
2012.09.18
申请号
KR20110020236
申请日期
2011.03.08
申请人
SHINHANDIAMONDINDUSTRIAL CO., LTD.
发明人
KIM, SHIN KYUNG;SONG, BRIAN;PARK, MUN SEAK;YU, BYOUNG RYOUN;KIM, KANG JUN;PARK, SUN WOO;KIM, JEONG;BYUN, SUNG KEUN;KIM, KYOUNG JIN;JUNG, HYUNG NOH