发明名称 |
Thermal dissipation for imager head assembly of remote inspection device |
摘要 |
An imager head assembly for a remote inspection device includes an imager housing. A circuit board is positioned within the imager housing. The circuit board has a light emitting diode connected thereto. A thermally conductive material in contact with the circuit board and the imager housing creates a conductive heat transfer path to dissipate heat generated by the light emitting diode through the imager housing. A light transmissive light pipe unit can be positioned proximate the circuit board to permit light emitted by the light emitting diode to pass through the light pipe unit. |
申请公布号 |
US8269828(B2) |
申请公布日期 |
2012.09.18 |
申请号 |
US20080038337 |
申请日期 |
2008.02.27 |
申请人 |
MILLER JEFFREY J.;BOEHNLEIN AL;NEWMAN TYE;PERCEPTRON, INC. |
发明人 |
MILLER JEFFREY J.;BOEHNLEIN AL;NEWMAN TYE |
分类号 |
H04N3/36 |
主分类号 |
H04N3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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