发明名称 Substrate holding apparatus, polishing apparatus, and polishing method
摘要 A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.
申请公布号 US8267746(B2) 申请公布日期 2012.09.18
申请号 US20080222909 申请日期 2008.08.19
申请人 YASUDA HOZUMI;TOGAWA TETSUJI;NABEYA OSAMU;SAITO KENICHIRO;FUKUSHIMA MAKOTO;INOUE TOMOSHI;EBARA CORPORATION 发明人 YASUDA HOZUMI;TOGAWA TETSUJI;NABEYA OSAMU;SAITO KENICHIRO;FUKUSHIMA MAKOTO;INOUE TOMOSHI
分类号 B24B47/02;B24B37/005;B24B37/04;B24B37/30;B24B49/10;H01L21/304 主分类号 B24B47/02
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