发明名称 |
Reducing the switching noise on substrate with high grounding resistance |
摘要 |
An interconnection component includes a plurality of through-substrate vias (TSVs) penetrating through a substrate. The plurality of TSVs includes an active TSV having a first end and a second end. The first end of the active TSV is electrically coupled to a signal-providing circuit. The second end of the active TSV is electrically coupled to an additional package component bonded to the interconnection component. The plurality of TSVs further includes a dummy TSV having a first end and a second end, wherein the first end is electrically coupled to the signal-providing circuit, and wherein the second end is open ended.
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申请公布号 |
US8269350(B1) |
申请公布日期 |
2012.09.18 |
申请号 |
US201113149480 |
申请日期 |
2011.05.31 |
申请人 |
CHEN CHIH-CHIA;YEH CHAO-YANG;CHUNG MENG-LIN;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN CHIH-CHIA;YEH CHAO-YANG;CHUNG MENG-LIN |
分类号 |
H01L23/52;H01L23/48;H01L23/485;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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