发明名称 |
Semiconductor device having a plurality of adhesion area patterns and one or more non-adhesion area patterns |
摘要 |
Patterns provided on a surface of a substrate include an adhesion area pattern and one or more non-adhesion area patterns. A chip electrode on a backside of a semiconductor chip is attached to the adhesion area pattern by a conductive adhesive. Consequently, an area of patterns subjected to gold plating that is stable in a steady state is smaller in a substrate of the present invention than in a conventional substrate, resulting in reduction in costs. Further, the chip electrode is attached to the adhesion area pattern by a conductive adhesive in a liquid form. Consequently, a semiconductor device of the present invention allows reducing use of an expensive conductive adhesive compared with a conventional semiconductor device, resulting in reduction in costs.
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申请公布号 |
US8269353(B2) |
申请公布日期 |
2012.09.18 |
申请号 |
US20090635000 |
申请日期 |
2009.12.10 |
申请人 |
MIYATA KOJI;NAKANISHI HIROYUKI;OKITA MASAHIRO;TATSUMI KAZUAKI;YOKOBAYASHI MASATO;SHARP KABUSHIKI KAISHA |
发明人 |
MIYATA KOJI;NAKANISHI HIROYUKI;OKITA MASAHIRO;TATSUMI KAZUAKI;YOKOBAYASHI MASATO |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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