发明名称 |
Semiconductor light-emitting apparatus integrated with heat-conducting/dissipating module |
摘要 |
The invention relates to a light-emitting apparatus. The light-emitting apparatus includes a heat-conducting/dissipating module and at least one semiconductor light-emitting module. The heat-conducting/dissipating module includes a substantially cylindrical heat-conducting device having at least one flat portion and at least one heat-dissipating fin mounted on the circumference of the heat-conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat portion of the heat-conducting device. The plurality of exterior electrodes is disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and respectively connected to the plurality of exterior electrodes. The at least two conducting wires are connected to a power source or a grounding by being electrically connected to the plurality of exterior electrodes.
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申请公布号 |
US8267545(B2) |
申请公布日期 |
2012.09.18 |
申请号 |
US201113118977 |
申请日期 |
2011.05.31 |
申请人 |
CHEN JEN-SHYAN;NEOBULB TECHNOLOGIES, INC. |
发明人 |
CHEN JEN-SHYAN |
分类号 |
F21V21/00;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
F21V21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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