PACKAGE MODULE

摘要

PURPOSE: A package module is provided to electrically connect stacked packages without increasing the height of a package stack structure by inserting a lead frame into a package which is arranged on the lower side of the package module. CONSTITUTION: A first substrate(110) includes a wiring part(112). A first semiconductor chip(120) is mounted on one side of the first substrate. A first sealing member(130) seals one side of the first substrate. A first external connection terminal(140) is formed on the other side of the first substrate. A lead frame is inserted into the first sealing member of the first package.