SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to prevent the thickness of the semiconductor package from increasing by forming a ground member on the surface of a molding member and a side of a package substrate. CONSTITUTION: A package substrate(110) includes a ground pad(114) and a signal pad(112). A semiconductor chip(120) is electrically connected to the signal pad of the package substrate. A molding member(130) is formed on the upper side of the package substrate. A ground member(140) is electrically connected to the ground pad. An external connection terminal(150) is mounted on an internal circuit(116) exposed by the lower side of the package substrate.