RELEASE FILM FOR COVER-LAY LAMINATING IN FLEXIBLE PRINTED CIRCUIT BOARD

摘要

PURPOSE: A release film for laminating a coverlay of a flexible printed circuit board(FPCB) is provided to prevent leaving behind low molecular materials on a connector part of an outer lead bonder. CONSTITUTION: A release film for laminating a coverlay of a flexible printed circuit board is attached to one side or both sides of a bonding sheet laminated on a coverlay which protects circuit patterns on a FPCB. The material used in the release film is polypropylene having a structure of a chemical formula 2. In chemical formula 2, CHx is a comonomer, in which x has a value of 2-4. The comprised amount of the comonomer is 1-2%.