| 摘要 |
PURPOSE: An electronic device, a portable electronic terminal, and a method for manufacturing the electronic device are provided to prevent a chip or mold resin from being damaged by preventing warpage due to a curing shrinkage of under-fill between the chip and an interposer. CONSTITUTION: A first chip(3) is mounted on one side of an interposer. A second chip(4) is mounted on the other side of the interposer. A mold resin part covers the side and the bottom of the chip. The mold resin part is fixed to the upper side of a package substrate with adhesive. The package substrate includes core materials(21), a resin part(22), wiring parts(23,24,25,26), and vias(27,28,29). [Reference numerals] (AA) Figure showing a cross section structure of an electronic device(1) of an example |
