发明名称 WAFER PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a wafer processing apparatus which is capable of suppressing flow fluctuation of a processing liquid. <P>SOLUTION: A wafer processing apparatus 1 comprises a spin chuck 2 which holds a wafer W, and a processing liquid supply nozzle 3 which supplies a processing liquid to the wafer W. The processing liquid is stored in a processing liquid tank 5, and processing liquid supply piping 4 is provided between the processing liquid tank 5 and the processing liquid supply nozzle 3. In a middle portion of the processing liquid supply piping 4, a pump 6, a temperature control heater 7 and a filter 8 are provided. Processing liquid feedback piping 12 is branch-connected to a branch part J1, and the processing liquid feedback piping 12 is led to the processing liquid tank 5. In the processing liquid supply piping 4 at a downstream side rather than the branch part J1, a supply flow rate adjusting valve 9, a flowmeter 10 and a supply valve 11 are interposed. To a branch part J2 between the supply flow rate adjusting valve 9 and the flowmeter 10, processing liquid branch piping 15 is branch-connected, and an orifice 16 is provided in the processing liquid branch piping 15. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178512(A) 申请公布日期 2012.09.13
申请号 JP20110041570 申请日期 2011.02.28
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 MORIOKA TOSHIHITO;TAKAYAMA YUICHI
分类号 H01L21/304 主分类号 H01L21/304
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