| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a placement device which enables space saving and cost reduction of a cooling mechanism cooling a work-piece placed on a placement body. <P>SOLUTION: A placement device 10 of the present invention includes: a wafer chuck 11 on which a wafer W is placed for being subject to electric characteristic inspection of the wafer W; and a cooling mechanism 12 cooling the wafer W through the wafer chuck 11. The cooling mechanism 12 includes a heat exchanger 121 provided on a lower surface of the wafer chuck 11 and a cooling device 122 having a heat absorption part 122A absorbing heat from a heat medium 121A of the heat exchanger 121. The cooling device 122 is fixed to the heat exchanger 121 through the heat absorption part 122A. <P>COPYRIGHT: (C)2012,JPO&INPIT |
