发明名称 |
ADAPTIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL POLISHING |
摘要 |
The present disclosure provides a semiconductor manufacturing method. The method includes defining a plurality of time regions of pad life for a polishing pad in a chemical mechanical polishing (CMP) system; assigning a ladder coefficient to the polishing pad according to the plurality of time regions of pad life; defining a plurality of endpoint windows to the plurality of time regions, respectively, according to pad life effect; applying a CMP process to a wafer positioned on the polishing pad; determining a time region of a polishing signal of the wafer based on the ladder coefficient; associating one of the endpoint windows to the polishing signal according to the time region; and ending the CMP process at an endpoint determined by the endpoint window.
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申请公布号 |
US2012231555(A1) |
申请公布日期 |
2012.09.13 |
申请号 |
US201113045289 |
申请日期 |
2011.03.10 |
申请人 |
LEE CHU-AN;HUANG HUI-CHI;JANGJIAN PENG-CHUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
LEE CHU-AN;HUANG HUI-CHI;JANGJIAN PENG-CHUNG |
分类号 |
H01L21/66;B24B49/00;H01L21/306 |
主分类号 |
H01L21/66 |
代理机构 |
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