| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure in which connection reliability of first and second connecting object members and conduction reliability between electrodes are enhanced. <P>SOLUTION: The method of manufacturing a connection structure 1 includes: a step in which an anisotropic conductive paste layer 3 disposed on a first connecting object member 2 having a first electrode 2b on an upper surface 2a thereof; a step in which light is irradiated on the anisotropic conductive paste layer 3 to promote curing of the anisotropic conductive paste layer 3; a step in which, on an upper surface 3a of an anisotropic conductive paste layer 3B of a B-stage, a second connecting object member 4 having a second electrode 4b on a lower surface 4a thereof is laminated; and a step in which the anisotropic conductive paste layer 3B of the B-stage is heated and cured. An anisotropic conductive paste containing a curable compound, a thermosetting agent, a photocuring initiator, and a conductive particle 5 is used as the abovementioned anisotropic conductive paste and the quantity of the anisotropic conductive paste is used which is over 1.6 times of a Y value expressed in formula (1) and 6 times or less thereof. <P>COPYRIGHT: (C)2012,JPO&INPIT |
