POWER SEMICONDUCTOR MODULE, MANUFACTURING METHOD OF THE POWER SEMICONDUCTOR MODULE, AND ELECTRIC POWER CONVERSION APPARATUS

摘要

PROBLEM TO BE SOLVED: To prevent cracks and peeling in a connection member connecting a circuit body with a case in a power semiconductor module where the circuit body including a power semiconductor element is mounted in the case.

SOLUTION: A power semiconductor module includes: a circuit body having a power semiconductor element and a conductor member connecting with the power semiconductor element; a bag-shaped housing member housing the circuit body; and a connection member connecting the circuit body with the housing member. In the power semiconductor module, the housing member includes: a first heat radiation member and a second heat radiation member that are disposed facing each other so as to sandwich and hold the circuit body; a side wall connecting the first heat radiation member with the second heat radiation member; and an intermediate member formed around the first heat radiation member and connecting with the side wall, and the intermediate member is curved so as to protrude toward a housing space of the housing member. This structure reduces residual stress occurring in the connection member.

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