| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique that achieves a spiral inductor that does not reduce the degree of freedom of mounting. <P>SOLUTION: A semiconductor device 100 comprises: a first semiconductor substrate 1 and a second semiconductor substrate 2 that are disposed in substantially parallel; a plurality of first patterns 3 that are formed on a first opposed surface 1a of the first semiconductor substrate 1 opposite to the second semiconductor substrate 2 and are substantially parallel to one another; a plurality of second patterns 4 that are formed on a second opposed surface 2a of the second semiconductor substrate 2 opposite to the first semiconductor substrate 1 and are substantially parallel to one another; and a plurality of bump electrodes 5 forming a spiral inductor L by alternately conducting the plurality of first patterns 3 and the plurality of second patterns 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
