发明名称 |
DEFECTIVE CONDUCTIVE SURFACE PAD REPAIR FOR MICROELECTRONIC CIRCUIT CARDS |
摘要 |
An electrically conductive adhesive (ECA) for repairing electrically conductive pad and trace interconnects and a method of repairing interconnect locations. The method of repairing at least one defect within the area of electrically conductive circuitized substrate traces and pads outside of a pristine center area incorporates an ECA and a forming gas plasma. The ECA contains a mixture of components that allow the adhesive to be adapted to specific requirements. Curing the adhesive results in effective electrical connections being formed between the adhesive and the base pad so that the metallurgies of the conductors and of the ECA are effectively combined to engage and repair the conductor defect.
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申请公布号 |
US2012228013(A1) |
申请公布日期 |
2012.09.13 |
申请号 |
US201113041655 |
申请日期 |
2011.03.07 |
申请人 |
MATIENZO LUIS J.;PITELY SUSAN;CARD NORMAN A.;ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
MATIENZO LUIS J.;PITELY SUSAN;CARD NORMAN A. |
分类号 |
H05K1/00;B23K31/02;B82Y30/00;H01B1/00;H01B1/02;H01B1/04;H05K1/11 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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