| 摘要 |
In order to enable the heat generated by a semiconductor light-emitting element to be discharged efficiently, a light source module is equipped with: a circuit substrate, on the surface of which a semiconductor light-emitting element is mounted, and which is mounted on the placement-use base of a light source retention member; and an electricity supply attachment that supplies electricity to the semiconductor light-emitting element. The circuit substrate has a substrate part on which the semiconductor light-emitting element is mounted, and an electroconductive circuit, which is formed on the surface of the substrate part and has a pair of terminal parts and a light source connection part that connects the pair of terminal parts and the semiconductor light-emitting element. The electricity supply attachment has an insulating part formed of an insulating material having higher thermal conductivity than the substrate part, and an electroconductive part, all but a portion of which is embedded in the insulating part. The electricity supply attachment is attached to the light source retention member such that the insulating part presses at least a portion of the circuit substrate against the placement-use base. |
