EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME

摘要

An epoxy resin compound having an epoxy resin, a hardener, and an inorganic filler as major components is provided. The epoxy resin includes an epoxy resin expressed by Chemical Formula. Therefore, thermal conductivity may be increased by using an epoxy resin including a mesogenic structure that increases crystallinity. Also, a high heat dissipation circuit board may be provided by using the epoxy resin as an insulation material on a printed circuit board.