| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate conveyance carrier in which an object to be conveyed is suppressed from being destroyed or deformed when releasing the object to be conveyed, while suppressing occurrence of position deviation of the object to be conveyed even when applying heating processing such as a reflow process, and which is available iteratively. <P>SOLUTION: A substrate conveyance carrier 10 used for conveying a substrate comprises: a resin film 14 with adhesive layer in which an adhesive layer 16 tightly adhered with a lower surface of the substrate in a removable manner is provided on the resin film 14 of which the linear expansion coefficient is 50 ppm/°C; a support 12 made of a metal or a metal oxide; and fixing means iteratively usable for fixing the resin film 14 with adhesive layer onto the support 12 in a removable maner while making a surface of the resin film 14 with adhesive layer opposed to a surface on which the adhesive layer 16 is formed, and a surface of the support 12 into lamination planes. <P>COPYRIGHT: (C)2012,JPO&INPIT |
