| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can inhibit warpage of a substrate generated after curing a resin layer disposed on one surface of a substrate or after forming a conductor layer on one surface of the substrate. <P>SOLUTION: A semiconductor manufacturing method comprises at least a first process of holding a substrate W of a wafer-like semiconductor, in a warped state, on which a resin layer R1 is disposed on one surface Wa in such a manner that the whole region of the surface Wa is spherically swollen and a second process of curing the resin layer R1 after performing the first process. <P>COPYRIGHT: (C)2012,JPO&INPIT |
