METHOD OF MANUFACTURING LEAD FRAME FOR LIGHT-EMITTING DEVICE PACKAGE AND LIGHT-EMITTING DEVICE PACKAGE

摘要

A method of manufacturing a lead frame for a light-emitting device package and a light-emitting device package are provided. The method of manufacturing a lead frame for a light-emitting device package includes: preparing a base substrate for the lead frame; forming diffusion roughness on the base substrate; and forming a reflective plating layer on the diffusion roughness formed base substrate. A lead frame for a light-emitting device and a light-emitting device package having a wide viewing angle and a wide radiation width by surface processing are provided.