SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

摘要

A semiconductor module (300a) comprises a case, further comprising a storage space formed by a frame part (304A3) and a pair of partition parts (304A1, 304A2) which are positioned opposite one another so as to sandwich the frame part (304A3). The partition part (304A1) is configured with radiator parts (307A, 307B) and a support partition (3041) which supports the radiator parts (307A, 307B) upon the frame part (304A3). The partition part (304A2) is configured with a radiator part (307C) and a support partition (3043) which supports the radiator part (307C) upon the frame part (304A3). The radiator parts (307A, 307B) which are disposed upon the partition part (304A1) are disposed in a position opposite to and separated from each of a plurality of semiconductor element blocks. The periphery of the plurality of radiator parts (307A, 307B) is surrounded by the support partition (3041). The support partition (3041) is deformed so as to be hollowed on the inner part of the case from the frame part (304A3) toward the radiator parts (307A, 307B). Each of a plurality of insulation sheets (333) is tightly fitted and bonded to each of a plurality of lead frames (318, 319) and each of the plurality of radiator parts (307A, 307B).