发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 In a manufacturing process of a transistor including an oxide semiconductor film, oxygen doping treatment is performed on the oxide semiconductor film, and then heat treatment is performed on the oxide semiconductor film and an aluminum oxide film provided over the oxide semiconductor film. Consequently, an oxide semiconductor film which includes a region containing more oxygen than a stoichiometric composition is formed. The transistor formed using the oxide semiconductor film can have high reliability because the amount of change in the threshold voltage of the transistor by a bias-temperature stress test (BT test) is reduced.
申请公布号 US2012231580(A1) 申请公布日期 2012.09.13
申请号 US201213413684 申请日期 2012.03.07
申请人 YAMAZAKI SHUNPEI;SATO YUHEI;SATO KEIJI;MARUYAMA TETSUNORI;KOEZUKA JUNICHI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;SATO YUHEI;SATO KEIJI;MARUYAMA TETSUNORI;KOEZUKA JUNICHI
分类号 H01L21/42 主分类号 H01L21/42
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