SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device is provided to improve the mobility of sealing resins inputted to a cavity by thinning a suspending lead with a half etching process. CONSTITUTION: A protrusion(1j) is formed on the rear(1d) of a tap(1b) or the rear(1f) of a suspending lead(1e). The tap mounts a semiconductor chip(2). The suspending lead supports a plurality of leads and the tap. The protrusion is contacted with a film sheet(8) on a mold surface(9d) of a resin mold(9). A sealing body is formed by sealing resins. [Reference numerals] (1) Lead frame; (1b) Tap(Chip mounting unit); (1e) Suspension lead; (1f) Rear surface; (1j) Protrusion; (1k) Gap; (2) Semiconductor chip; (2b) Main surface; (8) Film sheet(Sealing sheet); (9) Resin forming mold; (9c) Cavity; (9d) Mold surface; (9e) Gate part