发明名称 COMPOUND SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a compound semiconductor device with high reliability and high pressure resistance by forming a buffer layer with high resistance for complete suppression of off-leak current while retaining the crystal quality of a compound semiconductor of an upper layer without doping impurities with high resistance during crystal growth of the buffer layer. <P>SOLUTION: At least one type selected from impurities, for example, Fe, C, B, Ti, Cr is introduced into at least a buffer layer 2a of a compound semiconductor layer structure 2 from the rear face of the compound semiconductor layer structure 2 to increase the resistance value of the buffer layer 2a. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178467(A) 申请公布日期 2012.09.13
申请号 JP20110040673 申请日期 2011.02.25
申请人 FUJITSU LTD 发明人 MINOURA YUICHI;YOSHIKAWA SHUNEI;TAGI TOSHIHIRO
分类号 H01L21/338;H01L21/336;H01L29/778;H01L29/78;H01L29/786;H01L29/812 主分类号 H01L21/338
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