发明名称 EXPOSURE UNIT AND PREALIGNMENT METHOD OF WAFER
摘要 <P>PROBLEM TO BE SOLVED: To provide an exposure unit and a prealignment of wafer in which a tact time can be shortened by mounting a wafer on a work chuck of an exposure device in a short time and accurately without providing any dedicated prealignment apparatus. <P>SOLUTION: A robot 17 holds a wafer W on a wafer placing table 25 and conveys the wafer from a processing unit 14 to an exposure device 15. For the wafer W being held on the wafer placing table 25, notches 28a, 28b and 29 provided on two sides 26 and 27 which are orthogonal with each other are detected by sensors 30a, 30b and 30c. On the basis of a deviation amount calculated from detection results and a predetermined reference position, the wafer placing table 25 is moved in X, Y and Z directions and rotated in a &theta; direction by a control section 18, thereby prealigning the wafer W. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178423(A) 申请公布日期 2012.09.13
申请号 JP20110040054 申请日期 2011.02.25
申请人 NSK TECHNOLOGY CO LTD 发明人 SUZUKI MIKIIKU
分类号 H01L21/68;G03F7/20;H01L21/027 主分类号 H01L21/68
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