SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

The present invention provides: a structure of a semiconductor device in which the formation of adhesive deposits is reduced and which has excellent yield; and a process for manufacturing the semiconductor device. This process for manufacturing a semiconductor device comprises: a step of arranging multiple semiconductor elements (106) on the main surface of a thermally releasable adhesive layer (a mount film); a step of forming an encapsulating material layer (108), which encapsulates the multiple semiconductor elements (106) on the main surface of the mount film, using a resin composition for semiconductor encapsulation purposes; and removing the mount film to thereby expose the lower surface (30) of the encapsulating material layer (108) and the lower surface (20) of each of the semiconductor elements (106). The contact angle of the lower surface (30) of the encapsulating material layer (108) after the step of removing the mount film is specified to 70° or less as measured using formamide.