| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device of an open package structure with a semiconductor laser element being exposed to outer air, which inhibits optical dust collection at a front side end face and at a rear side end face of the semiconductor laser element. <P>SOLUTION: A semiconductor laser device has an open package structure with a semiconductor laser element being exposed to outer air, and translucent members are bonded to a front side end face and a rear side end face of the semiconductor laser element via adhesives, respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
