METHOD OF MANUFACTURING WAFER LEVEL PACKAGE AND WAFER LEVEL PACKAGE

摘要

A method of manufacturing a wafer level package according to the present invention comprises mutually joining a device wafer (20) having a plurality of device chips mounted or formed within the surface, and a cap wafer (30) opposite the device wafer (20) and thereafter singulating the joined wafer for each device. The method includes a first groove forming step of forming a first groove (23) for singulation at least in either the device wafer (20) or the cap wafer (30) and a joining step of joining the device wafer (20) and the cap wafer (30) sequentially in the order. Hereby, it is possible to provide a method of manufacturing a wafer level package and a wafer level package, which are capable of increasing the wafer yield and the product yield.