| 摘要 |
A die-bonding film contains a glycidyl-group-containing acrylic copolymer (a) having a weight-average molecular weight of 500,000 or more and a phenolic resin (b), wherein the weight ratio (x/y) of the content x of the glycidyl-group-containing acrylic copolymer (a) to the content y of the phenolic resin (b) is 5 or more and 30 or less, and the die-bonding film substantially does not contain an epoxy resin having a weight-average molecular weight of 5000 or less. Thus, a die-bonding film having a high reliability is provided by which a sufficient adhering strength and an elastic modulus at a high temperature can be obtained before and after curing; the workability is good; air bubbles (voids) do not stay at the boundary between the die-bonding film and the adherend; and the die-bonding film can withstand a humidity resistance solder reflow test.
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