| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper alloy having good conductivity, high strength, excellent bendability, and excellent stress relaxation resistance. <P>SOLUTION: The copper alloy includes, by mass, 1.5 to 3.6% Ni, 0.3 to 1.0% Si, and the remainder consisting of copper with unavoidable impurities. The average crystal grain size of the copper alloy is 15 to 40 μm. In the results of the measurement by a SEM-EBSP method, the copper alloy has an average area ratio of the cube orientation ä001}<100> of 45% or more and a KAM value of 1.0 to 3.0. <P>COPYRIGHT: (C)2012,JPO&INPIT |
