| 摘要 |
The infrared sensor in accordance with the present invention includes a pyroelectric element, an IC device, and a surface-mounted package. The IC device is configured to process an output signal of the pyroelectric element. The package houses the pyroelectric element and the IC device. The package includes a package body and a package lid configured to transmit infrared rays to be detected by the pyroelectric element, and has electrical conductivity. The package body is provided on its surface with plural recessed parts arranged in tiers. The IC device is mounted on a bottom of the lower recessed part. The package body includes an output wiring configured to electrically connect an output terminal of the IC device to an external connection terminal and a shielding member interposed between the pyroelectric element and the output wiring. |
