发明名称 |
METHOD OF TRANSFERRING THIN FILM COMPONENTS AND CIRCUIT BOARD HAVING THE SAME |
摘要 |
Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method. |
申请公布号 |
US2012228008(A1) |
申请公布日期 |
2012.09.13 |
申请号 |
US201213416780 |
申请日期 |
2012.03.09 |
申请人 |
KONDOU RYUICHI;OTA KENICHI;TAIYO YUDEN CO., LTD |
发明人 |
KONDOU RYUICHI;OTA KENICHI |
分类号 |
H05K7/20;H05K1/02;H05K3/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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