| 摘要 |
<p>PURPOSE: A method for manufacturing a solid-state imaging element, the solid-state imaging element, and an electronic apparatus are provided to improve reliability of an electronic device using the solid-state imaging element by only curving a central portion of a device chip three-dimensionally. CONSTITUTION: A plurality of pixels(3) is two-dimensionally arranged in an imaging region(4). An imaging chip is made by forming a solid imaging device on a silicon semiconductor substrate. A vertical driving circuit(5) is composed with a shift register. A column signal processing circuit(6) eliminates intrinsic fixed pattern noise of a pixel. A horizontal driving circuit(7) outputs a pixel signal from each of the signal processing circuit. [Reference numerals] (5) Vertical driving circuit; (6) Column signal processing circuit; (7) Horizontal driving circuit; (8) System control circuit</p> |
