发明名称 POLISHING APPARATUS HAVING TEMPERATURE REGULATOR FOR POLISHING PAD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing apparatus provided with an enhanced pad contact element which is capable of swiftly increasing a surface temperature of a polishing pad to a target temperature. <P>SOLUTION: A pad temperature regulation mechanism is equipped with a pad contact element 11 which is in contact with the surface of the polishing pad 3 and a liquid supply system 30 which supplies temperature-controlled liquid to the pad contact element 11. The pad contact element 11 is equipped with a first liquid flow passage 21 and a second liquid flow passage 22 inside thereof which are connected in series. A plurality of baffles 25 that extend approximately perpendicular to the radius direction of a polishing table 2 are placed on each of the first liquid flow passage 21 and the second liquid flow passage 22. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012176449(A) 申请公布日期 2012.09.13
申请号 JP20110039586 申请日期 2011.02.25
申请人 EBARA CORP 发明人 MARUYAMA TORU;SONE CHUICHI;MOTOJIMA YASUYUKI
分类号 B24B37/015;H01L21/304 主分类号 B24B37/015
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