发明名称 TAPE FOR CONNECTING CIRCUITS, REEL OF ADHESIVE, USE OF LAMINATED TAPE AS CIRCUIT CONNECTING MATERIAL, USE OF LAMINATED TAPE FOR MANUFACTURE OF CIRCUIT CONNECTING MATERIAL, AND METHOD FOR MANUFACTURING CIRCUIT-CONNECTED BODY
摘要 <p>A reel (10) of an adhesive has a winding core (1), and an anisotropic conductive tape (5A) wound on the winding core (1). The anisotropic conductive tape (5A) has a tape-like base material (6), and an adhesive layer (8) formed on one surface of the base material. On the surface of the adhesive layer (8), an end mark (18) in a color different from that of the adhesive layer (8) is provided. The winding core (1) and the base material (6) are connected to each other by means of an end tape (12). The cover tape (14) covers a region (5b) where the adhesive layer (8) is not formed, said region being a part of the base material (6). The cover tape (14) and the end mark (18) are subjected to non-slip processing so as to increase friction with the rear surface (6c) of the base material (6). The friction suppresses a slip between portions of the anisotropic conductive tape (5A) wound on the winding core (1).</p>
申请公布号 WO2012121292(A1) 申请公布日期 2012.09.13
申请号 WO2012JP55827 申请日期 2012.03.07
申请人 HITACHI CHEMICAL COMPANY, LTD.;TATSUZAWA TAKASHI;FUJINAWA TOHRU;ISHIKAWA TAKAAKI;SEKI TAKASHI;KOBAYASHI KOUJI;SEKI KOTARO 发明人 TATSUZAWA TAKASHI;FUJINAWA TOHRU;ISHIKAWA TAKAAKI;SEKI TAKASHI;KOBAYASHI KOUJI;SEKI KOTARO
分类号 B65H75/28;C09J7/02 主分类号 B65H75/28
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