| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package in which warping of a base surface is reduced. <P>SOLUTION: The package comprises a conductive base plate 200; a semiconductor device disposed on the conductive base plate; and a metal wall 16 housing the semiconductor device and arranged on the conductive base plate, the metal wall being composed of material different from the conductive base plate. Since one pair of edge faces 100a and 100b opposing with each other have an arcuate shape and the metal wall also has an arcuate shape, the conductive base plate can suppress occurring of warping at the time of bonding, mounting substrate, or soldering a cap. <P>COPYRIGHT: (C)2012,JPO&INPIT |
