发明名称 METAL LAMINATE BOARD AND METHOD OF MANUFACTURING CORE SUBSTRATE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal laminate board that can be doubled in productivity by symmetrically forming two core substrates above and below an insulating base material, can prevent generation of waste since the insulating base material and carrier layers can be utilized as a bare substrate during manufacturing of a printed circuit board, and can be recycled as a resource, and to provide a method of manufacturing a core substrate using a metal laminate board. <P>SOLUTION: A metal laminate board according to the present invention comprises: an insulating base material; carrier layers of a metal material laminated on both surfaces of the insulating base material; and first metal thin films laminated on one surface of the carrier layers. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012178601(A) 申请公布日期 2012.09.13
申请号 JP20120110592 申请日期 2012.05.14
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE SANG-YOUP;RYU JOUNG-GUL;KIM DONG-SUN;CHOI JAE-HOON;SEO IN-HO;LEE JOON-SUNG
分类号 H05K3/00;H05K3/46 主分类号 H05K3/00
代理机构 代理人
主权项
地址