发明名称 Method for packaging semiconductors using anisotropic conductive adhesive
摘要 PURPOSE: An anisotropic conductive adhesive is provided to secure enough electrical connection between terminals and an insulating property between neighboring terminals. CONSTITUTION: An anisotropic conductive adhesive(1) includes: conductive particles(2) and heat radiation particles(3) with a higher melting point than that of the conductive particles; and a polymer(4) with a hardening temperature lower than the melting point of the conductive particles. The conductive particles are one or more selected from the group consisting of metal, non-metal and alloy.
申请公布号 KR101182714(B1) 申请公布日期 2012.09.13
申请号 KR20090075214 申请日期 2009.08.14
申请人 发明人
分类号 C09J9/02;H01B1/22 主分类号 C09J9/02
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