| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a conductive pattern having no scratch or dent on a thin film surface even under contact between substrates or with a conveyer or a suction pad in a conveying, throwing or receiving step during handling after thin film processing by forming at least a first conductive pattern and a second conductive pattern in the method of manufacturing the conductive pattern according to a subtractive method. <P>SOLUTION: A method of manufacturing a conductive pattern according to a subtractive method, in which the conductive pattern is comprised of at least a first conductive pattern portion and a second conductive pattern portion, includes in the order of descriptions a step (a) of forming a photocrosslinking resin layer on a substrate with a conductive layer formed on a surface thereof, a step (b) of curing the photocrosslinking resin layer in a portion corresponding to the first conductive pattern portion, a step (c) of performing thin film processing on the photocrosslinking resin layer by using an alkaline aqueous solution, a step (d) of curing the photocrosslinking resin layer at least in a portion corresponding to the second conductive pattern portion, a developing step (e) and an etching step (f). <P>COPYRIGHT: (C)2012,JPO&INPIT |
