| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate, by which a step of removing an unnecessary mask part can be eliminated and an unnecessary mask part is easily removed by using any force such as mechanical vibration or adhesive force. <P>SOLUTION: The method includes: (a) forming a polycrystalline silicon film 1 on a substrate 2; (b) forming an opening 3 in the formed polycrystalline silicon film 1; (c) providing a groove part 4 in a periphery of the opening 3; (d) allowing etching to progress so as to form a cavity 5 and to deepen a groove in the groove part 4; and (e) removing a part of a mask unnecessary part 6 when the groove part 4 penetrates. However, technology of the prior arts can be used for a photoresist layer, a mask layer or formation of an opening by etching. <P>COPYRIGHT: (C)2012,JPO&INPIT |
