| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a configuration, by which semiconductor components inside a controller are cooled by air and the controller is manufactured at low cost. <P>SOLUTION: The controller 3 is arranged in the rear of a cylindrical fan cover 29 which covers a motor cooling fan 30, and further, an inverter module 14 serving as a semiconductor element and mounted in the controller 3 is arranged on a position shifted to the rear on an extension line of the center of the motor cooling fan 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
