发明名称 A COOLING DEVICE WITH AT LEAST TWO COOLANT FLOW MODULES
摘要 A cooling device (14) for cooling a surface (10) is disclosed. The cooling device (14) comprises at least two coolant flow modules, an inlet manifold (2) and an outlet manifold (3). Each coolant flow module comprises at least one flow cell (9) arranged to guide a flow of coolant along a surface (10) to be cooled. The inlet manifold (2) is arranged to deliver coolant to each of the coolant flow modules, and the outlet manifold (3) is arranged to receive coolant from each of the coolant flow modules, the coolant flow modules being arranged fluidly in parallel between the inlet manifold (2) and the outlet manifold (3). The cooling device (14) further comprises a coolant return system (6) interconnecting the outlet manifold (3) and the inlet manifold (2) in such a manner that a closed coolant circuit (1) is formed by the inlet manifold (2), the coolant flow modules, the outlet manifold (3) and the coolant return system (6). A coolant circulation means, such as a pump (12), is arranged to cause coolant to circulate in the closed coolant circuit (1). A heat exchanger (7) is arranged to exchange heat between an air flow and coolant flowing in the coolant return system (6). In the cooling device (14) of the invention, the closed coolant circuit (1) provides efficient heat transfer from the surface (10) to be cooled without the disadvantages of an open coolant circuit requiring a coolant supply. The heat exchanger provides heat removal from the device (14) and makes the device (14) easy to install.
申请公布号 WO2012028144(A3) 申请公布日期 2012.09.13
申请号 WO2011DK00098 申请日期 2011.08.29
申请人 DANFOSS DRIVES A/S;OLESEN, KLAUS;PAULSEN, LARS 发明人 OLESEN, KLAUS;PAULSEN, LARS
分类号 F28D15/00;F28D15/02;H01L23/473 主分类号 F28D15/00
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