| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a vacuum processing device which enables a uniform plasma processing in a plane in a substrate. <P>SOLUTION: A vacuum processing device 1 includes a vacuum chamber 11 which has a substrate-setting part for setting a substrate S, and a plasma-forming part for plasma formation. The substrate-setting part has: a substrate-setting holder 31 to set the substrate S on; an air outlet 34 provided in the vacuum chamber 11 and connected to evacuation means; and a shield member 50 surrounding the substrate-setting holder 31. The shield member 50 has a plurality of openings formed to be spaced apart from each other along its circumferential direction. The total area of the opening formed on the side of the evacuation means is smaller than that of the opening formed opposite to the side of the evacuation means. <P>COPYRIGHT: (C)2012,JPO&INPIT |
